The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1998
Filed:
Jan. 17, 1996
Akiko Ida, Neyagawa, JP;
Wataru Hirai, Osaka, JP;
Muneyoshi Fujiwara, Katano, JP;
Osamu Okuda, Hirakata, JP;
Hirokazu Honkawa, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle. Also, a control unit is provided for deciding whether or not a component is present on the tray, and controlling the pickup head and the nozzle replacement units in such a manner that, if a component is present, picking up the component by the pickup nozzle and placing it onto the substrate, and if no component is present, replacing the pickup nozzle with the tray transfer nozzle, and picking up the tray and removing it to the tray removal box.