The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1998
Filed:
Jan. 03, 1995
Fred E Ostrem, Long Grove, IL (US);
Other;
Abstract
A method and structure for controlling solder height of a surface mount device on a substrate uses electrical connection pads (105, 105') disposed onto a substrate (101). A height control pad (111) is also disposed onto the substrate (101) positioned apart from the electrical connection pads (105, 105'). Solder fillets (107, 107', 113) are disposed onto both the electrical connection pads (105, 105') and the height control pad (111). A component (103) having an electrical termination portion (109, 109') in contact with the solder fillets (107, 107') associated with the electrical connection pads (105, 105 ') and a body portion (115) in contact with the solder fillet (113) associated with the height control pad (111). The resulting structure (100 has a height relationship (119) between the surface mount component (103) and the substrate (101) controlled principally by a quantity of solder in the electrically conductive solder fillet (113) is disposed onto the height control copper pad (111) and a geometry of the copper pads (105) and (105') and the height control copper pad (111).