The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1998
Filed:
May. 30, 1996
Applicant:
Inventors:
Masahiro Suzuki, Kawasaki, JP;
Haruhiko Yamamoto, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257685 ; 257686 ; 257712 ; 257723 ;
Abstract
A semiconductor module includes a plurality of elementary chip assemblies stacked with each other, wherein each of the elementary chip assemblies includes a semiconductor chip and a thermally conductive substrate supporting the semiconductor chip thereon. The elementary chip assemblies are stacked in a manner such that the bottom edge of the semiconductor chips are aligned to form a bottom surface of the semiconductor module, and interconnection electrodes are provided on the bottom surface.