The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 1998

Filed:

Aug. 15, 1996
Applicant:
Inventor:

Kazunobu Nishitani, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257181 ; 257688 ; 257689 ; 257723 ;
Abstract

A press pack power semiconductor device incorporates a number of semiconductor elements. The power semiconductor device has a first insulating frame surrounding each of the semiconductor elements and having a lattice for positioning the semiconductor elements. First and second hard metal electrode plates are provided on the respective sides of each semiconductor element. A first electrode member is in contact with the first hard metal electrode plate. A second insulating frame, having a lattice for positioning the second hard metal electrode plate, is laid on the first insulating frame. A second electrode member is provided. This second electrode member has a lattice-shaped groove in which a lattice-shaped frame portion of the second insulating frame is fitted for positioning.


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