The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 1998

Filed:

Apr. 07, 1997
Applicant:
Inventors:

Ryuji Sawaoka, Iyo-gun, JP;

Shinji Kouchi, Matsuyama, JP;

Toshio Muraki, Matsuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
523211 ; 523205 ; 523440 ; 525423 ; 525523 ; 525528 ; 525936 ;
Abstract

Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.


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