The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 1998

Filed:

Jun. 10, 1996
Applicant:
Inventor:

Jui-Cheng Lo, Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438718 ; 438720 ; 438725 ; 430313 ; 430317 ; 430318 ;
Abstract

A method for controlling the plasma etch bias of a patterned layer formed through plasma etching of a blanket layer formed beneath a patterned photoresist layer. There is first formed upon a semiconductor substrate a blanket layer. Formed upon the blanket layer is a patterned photoresist layer. The patterned photoresist layer is then treated through a pre-treatment method to form with a controlled degradation and a controlled flow a hardened patterned photoresist layer from the patterned photoresist layer. The hardened patterned photoresist layer is hardened against a further flow in a subsequent plasma etch method which is employed in etching the patterned layer from the blanket layer while employing the hardened patterned photoresist layer as an etch mask. Finally, the blanket layer is etched through the subsequent plasma etch method to form the patterned layer while employing the hardened patterned photoresist layer as the etch mask.


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