The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1998
Filed:
Dec. 08, 1995
Manabu Yabe, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a method and an apparatus for manufacturing a semiconductor integrated circuit, including a wafer test process, an assembling process and a sorting process, electric characteristics of a plurality of semiconductor integrated circuits formed on a wafer, is measured, and then stored in a memory means together with data of the position of each semiconductor integrated circuit. The plurality of semiconductor integrated circuits on the wafer are cut into individual semiconductor integrated circuit chips. On the basis of the position data and the electric characteristics of each of the semiconductor integrated circuit chips read from the memory means, the semiconductor integrated circuit chips are classified into at least two subsets each consisting of non-defective semiconductor integrated circuit chips having the same electric characteristics different from that of products included in the other subset, and the non-defective semiconductor integrated circuit chips included in each of the at least two subsets, are packaged for each of the at least two subsets, so that the sorting is simultaneously carried out.