The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1998
Filed:
Jul. 21, 1995
Masayoshi Onishi, Mukou, JP;
Seiji Kegai, Yamatokouriyama, JP;
Koichi Ozaki, Otokuni-Gun, JP;
Kaname Tamada, Ibaraki-Ken, JP;
Hiroyoshi Takagi, Kameoka, JP;
Hitachi Maxell, Ltd., Osaka-Fu, JP;
Maxell Seiki, Ltd., Kyoto-Fu, JP;
Abstract
A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.