The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 1998

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Charles Edwin Thorn, Newport, KY (US);

Frank Polakovic, Ringwood, NJ (US);

Charles A Mosolf, Juno Beach, FL (US);

Assignee:

Electrochemicals Inc., Maple Plain, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; C25D / ;
U.S. Cl.
CPC ...
252510 ; 252511 ; 252 22 ; 252 11 ; 252 29 ; 205122 ; 205125 ; 205162 ; 205164 ; 205205 ; 205166 ; 205183 ; 205118 ; 106472 ; 106476 ;
Abstract

A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.


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