The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 1998
Filed:
Jun. 09, 1994
Seiji Mizuoka, Moriguchi, JP;
Toshihiko Tsujikawa, Toyonaka, JP;
Kenji Okamoto, Hirakata, JP;
Kazuhiro Ikurumi, Katano, JP;
Youichiro Ueda, Takatsuki, JP;
Masanori Yasutake, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Abstract
A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.