The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 1998

Filed:

Aug. 28, 1995
Applicant:
Inventors:

Youhei Ishikawa, Kyoto, JP;

Toru Tanizaki, Kyoto, JP;

Hiroshi Nishida, Kawanishi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ; H01P / ;
U.S. Cl.
CPC ...
333254 ; 333248 ;
Abstract

A high-frequency integrated circuit which operates in a microwave band or in a millimeter wave band. The high-frequency integrated circuit has a plurality of devices with respective nonradiative dielectric waveguides such as an oscillator, a coupler, etc., and a substrate on which these devices are surface-mounted. Each of the devices has a pair of parallel conductors, a dielectric strip which is disposed between the conductors and propagates a high-frequency electromagnetic wave, a mounting surface which is formed on one of the conductors and is in contact with the substrate, and an end surface which is defined by an end of the conductors so as to be vertical to a traveling direction of the electromagnetic wave propagated in the dielectric strip and at which an end of the dielectric strip is exposed. The devices with a nonradiative dielectric waveguide are evaluated separately, and thereafter, the devices are surface-mounted on the substrate close to or in contact with one another.


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