The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 1998
Filed:
Dec. 11, 1995
Akio Katsumata, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor device for reducing the mounting area of semiconductor chips on the mounting substrate includes a first base substrate made of an insulating material, a semiconductor chip mounted on the first base substrate, a plurality of internal wiring elements disposed on the first base substrate, and a plurality of bonding elements respectively connecting the semiconductor chip and the internal wiring elements. A second base substrate made of an insulating material is disposed on the first base substrate, and a resin seals the semiconductor chip and the bonding elements. A plurality of lower electrodes are formed on a lower surface of the first base substrate, a plurality upper electrodes are formed on an upper surface of the second base substrates, and a plurality of through holes respectively connecting one of the lower electrodes to one of the upper electrodes are formed on an external side surface of the first and second base substrate.