The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 1998

Filed:

Jul. 03, 1996
Applicant:
Inventors:

Toshiaki Ueno, Yokohama, JP;

Mitsuchika Saito, Kawasaki, JP;

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257415 ; 257418 ; 257420 ; 257692 ;
Abstract

An electrical connection structure interconnects a first circuit member and a second circuit member and comprises a cantilever, a conductive needle, a terminal pad and a fixing element. The cantilever is formed in the semiconductor substrate and has an end remote from the semiconductor substrate. The conductive needle is at the end of the cantilever and is electrically connected to the first circuit member. The terminal pad is located on the second circuit member opposite the conductive needle tip when the first circuit member and the second circuit member are juxtaposed. The terminal pad is electrically connected to the second circuit member. The fixing element fixes the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad.


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