The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 1998

Filed:

Dec. 30, 1996
Applicant:
Inventors:

Hideo Shikata, Chiba, JP;

Jun Sakai, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F / ; B22F / ;
U.S. Cl.
CPC ...
419 38 ; 419 47 ; 425 78 ; 29DI / ; 75228 ; 75249 ; 7457 / ; 7457 / ;
Abstract

Disclosed is a manufacturing process of a sintered connecting rod assembly comprising a first member with a projection and a second member with a concavity in which the first member and the second member are mated with each other by engaging the projection with the concavity. A powdered raw material is compacted into a first compact and a second compact for the first and second members, wherein the projection of the first compact has a width slightly larger than the width of the concavity of the second compact. Then the projection of the first compact is engaged with the concavity of the second compact to mate the first compact with the second compact, thereby the projection and the concavity are tightly pressed against each other. After sintering the mated first and second compacts, they are forced to release the projection from the concavity. The die for compacting the raw material has a whole cavity and a removable core for dividing the whole cavity into two cavities.


Find Patent Forward Citations

Shikata, Hideo. (1998). Manufacturing process of connecting rod assembly and compacting die (U.S. Patent No. 5722036). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5722036

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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