The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 1998
Filed:
Jun. 25, 1992
Noriyoshi Yokosuka, Iruma, JP;
Shizuo Suzuki, Oume, JP;
Enya Systems, Limited, , JP;
Abstract
A wafer mounting device transfers a wafer coated with an adhesive and pastes the wafer on a mount plate while maintaining the thickness of the adhesive uniform. A chuck plate is carried by a rotatable transfer arm and holds the adhesive-coated wafer by suction so that the wafer can be moved in a direction of rotation of the arm. The chuck plate is heated by a heater to substantially the same temperature as the wafer. A flexible pressing pad is disposed between the chuck plate and the transfer arm for biasing the chuck plate in a direction away from the arm, and a flexible pressure-adjusting pad is provided for biasing the chuck plate in a direction toward the arm. The pressing pad and the pressure-adjusting pad have hollow sections filled with pressurized fluid, and the pressure of the fluid within each pad is regulated to thereby control the pressing force of the chuck plate so that the wafer is placed softly on the mount plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile