The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1998
Filed:
Jul. 30, 1996
Ryuji Ninomiya, Ageo, JP;
Junichi Matsunaga, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
Described is a lead-free tin-zinc-based soldering alloy made up of 7 to 9 wt. % of Zn and 0.1 to 0.5 wt. % of Cu or which further contains not more than 3 wt. % of Bi and, in either case, the balance being Sn except for inevitable impurities. The present invention has made it possible to provide a lead-free soldering alloy which has mechanical properties, such as tensile strength and elongation, comparable with those of conventional Pb--Sn soldering alloys without adding thereto lead which causes environmental pollution, has a melting point not higher than 200.degree. C., which is lower than the heat-resistant temperature of an IC package, and has a low cost.