The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 1998
Filed:
Dec. 14, 1995
Applicant:
Inventors:
Tadashi Tonegawa, Shiki-gun, JP;
Junzo Wakuda, Kashihara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D / ;
U.S. Cl.
CPC ...
125 1602 ; 125 21 ; 125-1 ;
Abstract
A multi-wire saw device for slicing a semiconductor ingot and method therefore provides a plurality of spaced wires for cutting the ingot which is held by two sets of clip boards therebetween. The sets of clip boards form a holding means which may ascend and descend in order to engage the cutting wires. The multi wire saw device includes a cassette having chambers partioned by wires extending between opposite cassette ends and into which individual wafers fall. The cassette is formed with teflon resin for easy entry of the wafers.