The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 1998
Filed:
Nov. 06, 1995
Eiichi Mori, Tokyo, JP;
Sadahiko Yokoyama, Tokyo, JP;
Masatoshi Iji, Tokyo, JP;
Yuji Ikuta, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A printed wiring board, on which an electronic parts are mounted and fixed by way soldering, is introduced into a heating furnace for heating at a temperature higher than or equal to a melting temperature of a solder. After sufficiently melting of solder, an impact force and/or a shearing force are applied. By this under a reduced connecting force, the electronic parts are removed from a printed wiring board. On the other hand, since the parts can be easily removed from the printed wiring board. Also, the parts and the printed circuit are separated for collecting useful substance and can improve resistance to enhance recycling efficiency.