The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 1998

Filed:

Jan. 02, 1997
Applicant:
Inventors:

Peter B Hogerton, White Bear Lake, MN (US);

Kenneth E Carlson, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
428344 ; 428209 ; 428901 ; 29829 ; 29832 ; 174255 ; 174257 ; 174259 ; 174260 ; 361762 ; 361767 ; 361779 ;
Abstract

The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.


Find Patent Forward Citations

Hogerton, Peter. (1998). Deformable substrate assembly for adhesively bonded electronic device (U.S. Patent No. 5714252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5714252

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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