The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 1998

Filed:

Aug. 09, 1996
Applicant:
Inventors:

Jose A Osuna, Jr, San Diego, CA (US);

Stephen M Dershem, San Diego, CA (US);

Assignee:

Quantum Materials, Inc., San Diego, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K / ;
U.S. Cl.
CPC ...
25218218 ; 437211 ;
Abstract

In accordance with the present invention, there are provided novel propargyl ether-based compositions that are very effective when used in underfill applications. Aromatic propargyl ether compounds are believed to represent the most robust resin chemistry currently available to meet the many performance requirements associated with underfill applications. Propargyl ether resins are hydrophobic, hydrolytically stable, low toxicity monomers that can be cured to high T.sub.g, thermally stable thermosets. Liquid propargyl ether monomers have been found and/or described in the literature which can be used alone or in combination to yield diluent free underfill compositions. Alternatively, mixtures of two or more propargyl ether monomers (wherein one or more of these monomers may be solids at room temperature) can be used to create diluent-free, room temperature stable, eutectic or peritectic liquid resin compositions. In accordance with the present invention it has furthermore been found that transition metal compounds (in chelated or soap forms) can be used to catalyze the rapid cure of propargyl ether monomers. This cure is especially facile in the presence of additional coordinating ligand additives.


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