The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 1998
Filed:
Jan. 26, 1996
Yoshinobu Akiba, Shizuoka, JP;
Makoto Katsumata, Shizuoka, JP;
Hitoshi Ushijima, Shizuoka, JP;
Hidenori Yamanashi, Shizuoka, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic resin; heating and retaining the mold so that the circuit body is bonded to the board under heat and pressure; and releasing the mold from the board after cooling the board to thereby transfer the circuit body to the board. The circuit board may be in the shape of box with the circuit body on the inner surfaces thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile