The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1998
Filed:
Sep. 06, 1995
Makoto Suzuki, Ibaraki-ken, JP;
Osamu Matsumoto, Ibaraki-ken, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A resin composition for low expansion moldings which comprises (A) 20 to 80 parts by weight of a vinyl chloride resin having an average degree of polymerization of from 500 to 1700 and (B) correspondingly from 80 to 20 parts by weight of a copolymer made of 60 to 90 parts by weight a polymerizable monomer mixture consisting of 20 to 40 wt % of acrylonitrile, 20 to 60 wt % of .alpha.-methylstyrene and 20 to 40 wt % of styrene and, correspondingly, 40 to 10 parts by weight of a crosslinked acrylic rubber. The resin composition further comprises (C) 0.5 to 30 parts by weight of an acrylic resin having a reduced viscosity of not less than 3.0 dl/g when measured by use of a chloroform solution of the acrylic resin at a concentration of 0.1 g/100 ml, (D) 0.1 to 10 parts by weight of a thermally decomposable rosining agent, and (E) from 1 to 10 parts by weight of a stabilizer, each based on 100 parts by weight of a mixture of the components (A) and (B).