The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1998
Filed:
Jun. 11, 1996
Richard August Budde, Plymouth, MN (US);
Kevin Jon Schultz, Apple Valley, MN (US);
Daniel E Glumac, Little Canada, MN (US);
Patrick J Ryan, St. Paul, MN (US);
Cal E Hardie, Edina, MN (US);
Seagate Technology, Inc., Scotts Valley, CA (US);
Abstract
An apparatus comprising a magnetic head suspension assembly (10) comprised of a rectangular portion (12), load beam (14) and flexure (16) fabricated from a silicon structure using the etching techniques of the integrated circuit fabrication industry. Said magnetic head suspension assembly (10) having electrical leads (23) to a slider, a pre-amp circuit (25) and a microactuator (27) fabricated directly thereon. A system of providing a loading force passing to slider (50) comprising either a tapered base plate (40) adapted to be held by a horizontally oriented actuator arm or an actuator arm (60) having at least one angled receiving surface (62,64) for attachment to said suspension assembly. The method of forming a magnetic head suspension assembly (10) from an etched silicon structure comprising a cutting step comprising cutting said silicon structure into the silhouette shape of a magnetic head suspension assembly, having a rectangular portion (12), a load beam (14) and a flexure (16), said flexure being cut in a shape such that finger members (18), slider bond tongue (19) and dimple tongue (20) appear thereon, and subsequent to said cutting step, the step of photo-etching regions of said silicon structure to reduce thickness of said silicon structure in certain regions, said photo-etching leaving a remaining non-etched small plateau area which is adapted to act as a point or dimple for an attached slider to gimbal about.