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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5708959 B1

PDFFull Text
Date of Patent:
Jan. 13, 1998

Filed:

Apr. 22, 1996

Substrate for semiconductor apparatus

Applicant:
Inventors:

Mituo Osada, Itami, JP;

Yoshinari Amano, Itami, JP;

Nobuo Ogasa, Itami, JP;

Akira Ohtsuka, Itami, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Attorney:

Foley & Lardner

Primary Examiner:

Daniel J Jenkins

Int. Cl.
CPC ...
B22F / ; B22F / ; H01L / ;
U.S. Cl.
CPC ...
428552 ; 428546 ; 428615 ; 437902 ; 437925 ; 257706 ; 257707 ; 257713 ; 257717 ; 257720 ; 419 27 ;
Abstract

This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

Find Patent Forward Citations

Osada, Mituo. (1998). Substrate for semiconductor apparatus (U.S. Patent No. 5708959). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5708959

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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