The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 1998

Filed:

Dec. 28, 1995
Applicant:
Inventor:

George Frank DeVeau, Cumming, GA (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385 49 ;
Abstract

This invention is directed to a apparatus for coupling an optical fiber end holder at houses an end portion of one or more optical fibers in a spaced arrangement, to respective optical waveguides coupled to an optical integrated circuit (OIC) housed in an OIC unit. The apparatus includes a bridge member situated to extend across an interface between end surfaces of the holder and the unit. The apparatus also includes a shim layer with a first side that contacts the bridge member and a second side that contacts portions of the holder and the unit adjacent their respective ends surfaces. The shim layer, when in its uncured, liquid state, allows the ends of the optical fibers and the optical waveguides exposed in the ends surfaces of the holder and unit, respectively, to be aligned. In its cured, sold state, the shim substance fixes the postional relationship of the holder and the unit relative to the bridge member and thus also fixes the alignment of the end of the optical fiber relative to the optical waveguides. Preferably, a refractive index matching substance is situated between the ends surfaces of the unit and holder. The index matching substance is preferably a material that can withstand high temperature and humidity conditions so that the interconnection assembly of this invention is reliable and durable compared to previously known devices, particularly those devices that use epoxy between an optical fiber and an optical waveguide of an OIC.


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