The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 1998
Filed:
Sep. 05, 1995
Alan H Woosley, Austin, TX (US);
Everitt W Mace, Hutto, TX (US);
Other;
Abstract
An overmolded semiconductor device (30, 50) has a contoured package body profile instead of a conventional flat package body surface for uniform filling during the molding process. A cross-section of the semiconductor device reveals a substantially uniform thickness of plastic (36 and 38) covering the carrier substrate (14) and overmolding the semiconductor die (12). Alternatively, a thicker layer of plastic (58) overmolds the semiconductor die (12') than the layer of plastic (56) covering the carrier substrate (14'). The contoured package body profile is designed to allow a uniform flow front progression of molding compound during the molding process to eliminate voids in the package body by providing the same resistive pressure to the molding compound flow front during filling.