The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 1998
Filed:
Feb. 26, 1996
Keiji Toriyama, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A lead frame has a frame section for carriage, a square die pad for mounting a semiconductor chip, and four suspension arms bridging the frame section and corners of the die pad. The die pad has a plurality of oblique slits therein extending parallel to one another and parallel to a diagonal line of the die pad passing first and second corners of the die pad. During encapsulation, resin is introduced from a gate of molding dies located at the first corner to a vent of the molding dies located at the second corner. The oblique slits enhances oblique resin-flow under the lower surface of the die pad during encapsulation of the semiconductor device, to thereby prevent a die pad shift, unfilling of the resin and resin void in the semiconductor device.