The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1998
Filed:
Jul. 14, 1995
Applicant:
Inventor:
Shinji Takei, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kanagawa-ken, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361760 ; 361736 ; 257675 ; 257676 ; 357 72 ; 357 70 ; 174 522 ; 427211 ; 428 76 ;
Abstract
A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.