The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 1998

Filed:

Sep. 06, 1996
Applicant:
Inventors:

Robert Thomas Carson, Lantana, FL (US);

Lisa Reckleben, Boynton Beach, FL (US);

Dawn He Zhong, Lake Worth, FL (US);

Arnold William Hogrefe, Jr, Ft. Lauderdale, FL (US);

Scott Lawrence Joslin, Boca Raton, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ;
U.S. Cl.
CPC ...
257737 ; 257783 ; 257668 ; 361760 ;
Abstract

An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).


Find Patent Forward Citations

Loading…