The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1998
Filed:
Apr. 15, 1996
Hitachi, Ltd., , JP;
Abstract
A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.