The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1998
Filed:
Aug. 19, 1996
Applicant:
Inventors:
Kurt Faller, Brugg, CH;
Toni Frey, La Jolla, CA (US);
Helmut Keser, Ennetbaden, CH;
Ferdinand Steinruck, Mosen, CH;
Raymond Zehringer, Kunten, CH;
Assignee:
Asea Brown Boveri AG, Baden, CH;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257719 ; 257718 ; 257785 ; 257727 ; 257726 ; 257177 ; 257181 ; 257690 ;
Abstract
A power semiconductor module is specified in which at least one semiconductor chip, which is fitted on a baseplate, is made contact with by a respective contact plunger. The position of the contact plungers can be set individually in a manner corresponding to a distance between the semiconductor chips and a main connection which accommodates the contact plungers. The contact plungers are either subjected to pressure by means of a spring or fixed by means of a solder layer.