The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1998
Filed:
Aug. 15, 1994
Noriyuki Ashiwake, Tsuchiura, JP;
Takahiro Daikoku, Ushiku, JP;
Kenichi Kasai, Hadano, JP;
Keizou Kawamura, Tsuchiura, JP;
Hideyuki Kimura, Tsuchiura, JP;
Atsuo Nishihara, Ibaraki-ken, JP;
Toshio Hatada, Tsuchiura, JP;
Toshiki Iino, Ibaraki-ken, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.