The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 1998

Filed:

Mar. 12, 1996
Applicant:
Inventors:

Meng-Chun Chen, Tainan, TW;

Weng-Jung Lu, Hisinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; B23K / ;
U.S. Cl.
CPC ...
228 41 ; 228246 ; 221269 ;
Abstract

An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.


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