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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5704117 B1

PDFFull Text
Date of Patent:
Jan. 06, 1998

Filed:

Jun. 13, 1996

Method of assembling an emi shield around an electronic component

Applicant:
Inventors:

Henry WC. Mok, Kanata, CA;

Kevin J Bailey, Ottawa, CA;

Paul A Lindsay, Ottawa, CA;

Robert C Sheffield, North Gower, CA;

Michal S Tencer, Nepean, CA;

Assignee:

Northern Telecom Limited, Montreal, CA;

Attorney:

Austin; R. J.

Primary Examiner:

Carl J Arbes

Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29841 ; 174 / ;
Abstract

An EMI shield for a component mounted upon a printed circuit board. The shield is an open sided box made from plastic insulating material supporting an electrically conductive shield layer. A surrounding flange is provided by the plastic at the open side of the box, the flange having a surface facing outwards in the same direction as the open side. The conductive shield layer extends onto the outward facing surface.

Find Patent Forward Citations

Mok, Henry. (1998). Method of assembling an emi shield around an electronic component (U.S. Patent No. 5704117). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5704117

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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