The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 1997
Filed:
Feb. 12, 1996
Applicant:
Inventor:
Masahiko Hori, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257783 ; 257787 ; 257666 ;
Abstract
In the resin-sealed type semiconductor device of the present invention, the inner lead is adhered onto the semiconductor element via the insulating tape, and electrically connected to the semiconductor element. The inner lead, the insulating tape and the semiconductor element are sealed by resin in a package. The outer lead is integrated with the inner lead to form a step, formed thicker than that of the inner lead, and has an exposed surface in the same plane as the upper surface of the package.
Hori, Masahiko. (1997). Resin-sealed type semiconductor device (U.S. Patent No. 5703407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5703407
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile