The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 1997

Filed:

Nov. 08, 1996
Applicant:
Inventors:

Mitsuyoshi Endo, Ebina-shi, Kanagawa-ken, JP;

Hironori Asai, Yokohama-shi, Kanagawa-ken, JP;

Keiichi Yano, Kawasaki-shi, Kanagawa-ken, JP;

Yoshitoshi Sato, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257701 ; 257697 ; 257700 ; 257704 ; 257705 ;
Abstract

A semiconductor ceramic multilayer package comprising an aluminum nitride substrate having a semiconductor element mounted on one surface thereof and a wiring pattern electrically connected to the semiconductor element, connecting terminals connected to the wiring pattern and disposed on the other surface of the aluminum nitride substrate, and a sealing member connected to the aluminum nitride substrate with a metallic bonding layer or a glass layer having a thickness of not more than 100 .mu.m in such a manner as to seal the semiconductor element possesses a notably improved heat-radiating property and accomplishes the object of increasing the number of pins and reducing the size of package.


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Endo, Mitsuyoshi. (1997). Semiconductor package having an aluminum nitride substrate (U.S. Patent No. 5703397). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5703397

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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