The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 1997
Filed:
Oct. 31, 1996
Applicant:
Inventor:
Kenichi Kurihara, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257692 ; 257696 ; 257693 ; 257666 ; 257700 ;
Abstract
In a plastic encapsulated semiconductor device, there is used a lead frame including an island for bearing thereon a semiconductor chip, a number of terminal leads extending outwardly from a proximity of the island, a pair of wing leads extending outwardly from a pair of opposite short-sides of the island. The wing leads are not coupled with tie-bars of the lead frame, and are positioned in a plane lower in level than a plane of the terminal leads. With this arrangement, even if pitch of the terminal leads is narrowed, the wing leads can be made not to interfere interfering with the terminal leads.