Ball grid array socket assembly

Abstract

A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies. The multi-fingered upper ends of the contact assemblies engage the BGA ball contact at multiple points to reduce creep associated failure of the contact, while a pivoting contact body portion provides relative movement between the BGA contact ball and the circuit board substrate to reduce thermal expansion stresses. The lower end of the contact assembly may comprise a removable, pivotable post which permits visual inspection of the terminal post solder joint on the terminal pad of the circuit board.