The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 1997
Filed:
Jun. 07, 1995
Kenneth L Biggs, Orange, CA (US);
John Cairl Price, Rancho Mirage, CA (US);
West Bond Inc., Anaheim, CA (US);
Abstract
An alignment method for ultrasonic wire bonders of the type using capillary ball type and wedge type bonding tools utilizes a bonding tool construction having an elongated shank angle obliguely At any desired azimuthal angle from the lower working face of a tool tip. This angular offset allows a workpiece to be positioned laterally to place a desired wire bond site on an integrated circuit or other such workpiece in precise alignment with a target image in the field of view of a television camera or other optical imaging device viewing the location of a desired bond site along the line of action of the tool tip. Because of the angular offset construction of the bonding tool, the line of site of the imaging device is coincident with the line of action of the tool tip eliminating parallax errors and permitting viewing of the bond site continuously during motion of the tool tip along its line of action.