Stackable modules and multimodular assemblies

Abstract

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or 'tub' of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules. The connector arrays can also serve to seal the assembly when the entire assemblage of modules is compressed and to connect the stacked modular assembly to exterior circuitry such as a printed circuit board or other device. Methods are also provided for assembling and electrically interconnecting electronic components within such stacked multimodular assemblies by attaching components of an electronic circuit to at least two stackable modules of the type described within the cavity thereof, interconnecting the circuit components with the described through-vias, and stacking and interconnecting the stackable modules with the described multichannel connector arrays interposed between each adjacent module pair.