The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 1997
Filed:
May. 08, 1996
Applicant:
Inventors:
Takao Shimizu, Nagoya, JP;
Hirotsugu Horio, Tokai, JP;
Assignee:
Daido Steel Co., Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228194 ; 22826271 ; 148526 ; 219617 ;
Abstract
A method of firmly jointing Ti-alloy members of various shapes such as pipes and rods by solid diffusion bonding. The members are butted and heated under pressure in a non-oxidizing atmosphere, while a Ti-layer is disposed at the interface of butting by either (1) inserting a sheet for bonding made of Ti having a thickness of 500 .mu.m or less between the butted faces, or (2) previously forming a Ti-layer for bonding having a thickness of 1 .mu.m or more on at least one of the butted faces by any method such as vapor deposition.