The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 1997

Filed:

Jul. 26, 1995
Applicant:
Inventors:

Osamu Tsurumiya, Saitama, JP;

Hitoshi Suda, Saitama, JP;

Kazuyuki Iwasaki, Osaka, JP;

Naofumi Inomata, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ; H05K / ;
U.S. Cl.
CPC ...
361803 ; 361796 ; 361743 ; 361736 ; 439 74 ;
Abstract

An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.


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