The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 1997

Filed:

Dec. 26, 1995
Applicant:
Inventors:

Arno Neidig, Schwetzingen, DE;

Peter Kinzel, Buttelborn, DE;

Assignee:

Ixys Semiconductor GmbH, Lampertheim, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361752 ; 174 522 ; 257687 ; 361715 ;
Abstract

A power semiconductor module includes a plastic housing having a bottom plane in which a substrate is disposed. Disposed inside the module are the substrate, structures on the substrate, a rubber-like soft encapsulation and a hard encapsulation above the soft encapsulation. Internal struts of the housing extend into the soft encapsulation and, if appropriate, have ends with transverse extensions disposed within the soft encapsulation. The effect of this module construction is that a back pressure or reaction opposes forces acting externally on the substrate.


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