Surface-mount fuse having a substrate with surfaces and a metal strip

Abstract

A surface-mount fuse for protecting a circuit, includes a substrate having first and second surfaces, each surface having first, second, third, and forth ends, the substrate also having first, second, third, and fourth sides. The fuse also includes a metal strip evenly attached to the first surface of the substrate with a layer of adhesive material, the layer of adhesive material being disposed between the metal strip and the first surface of the substrate, the metal strip having a first connection region, a second connection region, and a non-linear fuse link therebetween. The fuse further includes first and second wire leads aligned substantially with and along the first and second connection regions, respectively, the first wire lead being conductively connected to the first connection region and horizontally projecting away from the first connection region, the second wire lead being conductively connected to the second connection region and horizontally projecting away from the second connection region, for connecting the fuse to the remainder of the circuit. The layer of adhesive material can include a polymeric material therein. One alternative for the wire leads can include clip leads or other terminal leads. The fuse also includes a protective layer disposed on the fuse link, the protective layer being in contact with and surrounding the upper and side surfaces of the fuse link of the metal strip. A method of making the same is also disclosed herein.