The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 1997
Filed:
Jan. 19, 1996
Shigeru Nakamura, Nishikamo-gun, JP;
Yutaka Mizutani, Nishikamo-gun, JP;
Terukazu Shibata, Nishikamo-gun, JP;
Toru Ozaki, Nishikamo-gun, JP;
Kansai Paint Co., Ltd., Amagasaki, JP;
Abstract
The present invention provides a method for film formation, which comprises applying onto a substrate an electrocoating (A) and an intermediate coating (B) in this order, heat-curing the formed films of the coatings (A) and (B), applying thereon a liquid light color coating (C), the liquid light color coating (C) forming a color film having an L value of 30-95 in the Lab color system, which comprises 100 parts by weight of a thermosetting resin composition, 0.1-30 parts by weight of a fine aluminum powder having an average particle diameter of less than 10.mu. and 1-200 parts by weight of a titanium oxide pigment and which shows a film hiding power of 25.mu. or less and a film elongation ratio of 10-50% at 20.degree. C., a liquid metallic coating (D) which comprises 100 parts by weight of a thermosetting resin composition and 0.1-20 parts by weight of a metallic pigment having an average particle diameter of 3.mu. or more and which shows a film hiding power of 50.mu. or more and a film elongation ratio of 10% or less at 20.degree. C., and a clear coating (E) in this order on a wet-on-wet basis, and heating the formed films of the coatings (C), (D) and (E) to crosslink and cure the three films simultaneously. According to the method, part of the heat-curing steps employed in multilayer film formation can be eliminated and a multilayer film of smaller thickness and improved properties (e.g. improved surface smoothness and chipping resistance) can be obtained.