The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 1997

Filed:

Oct. 09, 1996
Applicant:
Inventors:

Russell Keith King, Midland, MI (US);

Chi-Long Lee, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525478 ; 525477 ; 528 15 ; 528 17 ; 528 18 ; 528 21 ;
Abstract

The invention pertains to an dual-cure silicone adhesive composition that is extrudable and flowable at room temperature in the absence of a solvent comprising (A) 40 to 95 parts of an alkenyl functional siloxane resin said resin containing 0.01 to 22 wt% alkenyl functionality; (B) 0.5 to 20 parts of a SiH containing polyorganosiloxane having an average of at least 1.7 silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.8 to 2,000 mm.sup.2 /s; (C) a silane represented by monomers of the formula R.sup.1.sub.4-y Si(OR.sup.2).sub.y or oligomeric reaction products thereof; (D) a hydrosilylation catalyst in sufficient quantity to promote curing of said composition; (E) a moisture curing catalyst to promote the moisture initiated reaction of the alkoxy radicals; (F) optionally, 0.1 to 70 parts of a polydiorganosiloxane having at least two ethylenically or acetylenicaly unsaturated groups per molecule and having a viscosity of 100 to 80,000 mm.sup.2 /s; and (G) optionally, an inhibitor in sufficient quantity for the composition to be stable at room temperature; wherein at least one of said resin (A), SiH containing polyorganosiloxane (B) and/or optional polydiorganosiloxane (F) contain a curing radical of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x.


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