The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 1997

Filed:

Oct. 19, 1995
Applicant:
Inventors:

Yasushi Ideta, Kikuchi, JP;

Akihiro Washitani, Kikuchi, JP;

Tsunenori Umetsu, Kikuchi, JP;

Keiko Kaneko, Kikuchi, JP;

Kunio Kobayashi, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257723 ; 257724 ; 257726 ; 257727 ;
Abstract

A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.


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