The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 1997
Filed:
Feb. 04, 1994
Applicant:
Inventors:
Gunther Schuster, Gammelshausen, DE;
Klaus Panitsch, Kirchheim, DE;
Assignee:
Deutsche Aerospace AG, , DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437225 ; 437927 ; 437974 ; 148D / ; 148D / ;
Abstract
A process for the laminar joining of two or more silicon semiconductor slices (wafers) under the effect of pressure and heat, in which a thin layer of a semiconductor-compatible material is applied to at least one of the surfaces to be joined.