The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 1997
Filed:
Feb. 21, 1996
Applicant:
Inventor:
Josef Mathuni, Munchen, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
1566451 ; 1566431 ; 15665911 ; 216 52 ; 216 67 ; 437226 ; 437225 ;
Abstract
A method for making large scale integrated circuits on a disklike semiconductor substrate includes grinding a disk thin enough to be able to be sawn apart into individual chips. A damage zone caused by the grinding on a back side of the wafer is removed by etching while protecting a front side of the wafer, prior to sawing. The etching is carried out in the form of a microwave or high-frequency-excited downstream plasma etching process using fluorine compounds in an etching gas.