The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 1997
Filed:
Jun. 01, 1995
Masaaki Taniguchi, Fukui-ken, JP;
Kyoshin Asakura, Sabae, JP;
Abstract
A method of manufacturing laminated ceramic electronic components includes a step of forming a block by laminating ceramic green-sheets each having a main surface on which interior electrodes are formed with intervals in a direction orthogonally intersecting the main surfaces of the green-sheets. In a first cutting step, a first dicing blade having a width of 0.3 mm is pressed against the block at positions corresponding to the intervals between the electrodes to form grooves extending from one main surface toward the other main surface of the block, thereby to form a green mother board series in which a plurality of green mother boards being divided by the grooves are connected to each other via connection portions. Each of the green mother boards includes a plurality of element portions. Thereafter, the green mother board series is fired in a firing step. In a second cutting step, a second dicing blade having a width of 0.4 mm is pressed into the grooves of the mother board series after firing, to cut the connection portions. In this second cutting step, a side surface of each said mother board is ground by a side surface of the second dicing blade to expose outer edges of the interior electrodes. An exterior electrode is then applied to the outer edges.